1/8 STPS745D/f/g/fp ? january 2002 - ed:5g power schottky rectifier i f(av) 7.5 a v rrm 45 v tj (max) 175 c v f (max) 0.57 v main product characteristics n very small conduction losses n negligible switching losses n extremely fast switching n insulated package: isowatt220ac, to-220fpac insulating voltage = 2000v dc capacitance = 12pf features and benefits single schottky rectifier suited for switch mode power supply and high frequency dc to dc con- verters. packaged either in to-220ac, isowatt220ac, to-220fpac or d 2 pak, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. description symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) rms forward current 20 a i f(av) average forward current d = 0.5 to-220ac / d 2 pak tc = 160c 7.5 a isowatt220ac/ to-220fpac tc = 145c i fsm surge non repetitive forward current tp = 10 ms sinusoidal 150 a i rrm repetitive peak reverse current tp = 2 m s square f = 1khz 1 a i rsm non repetitive peak reverse current tp = 100 m s square 2 a tstg storage temperature range - 65 to + 175 c tj maximum operating junction temperature * 175 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) a k to-220ac STPS745D a k d 2 pak stps745g a nc k *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink isowatt220ac stps745f a k to-220fpac stps745fp k a
STPS745D/f/g/fp 2/8 symbol parameter value unit r th (j-c) junction to case to-220ac / d 2 pak 3.0 c/w isowatt220ac/ to-220fpac 5.5 thermal resistances symbol parameter tests conditions min. typ. max. unit i r * reverse leakage current tj = 25 cv r =v rrm 100 m a tj = 125c 5 15 ma v f * forward voltage drop tj = 125 ci f = 7.5 a 0.5 0.57 v tj=25 ci f = 15 a 0.84 tj = 125 ci f = 15 a 0.65 0.72 static electrical characteristics pulse test : * tp = 380 m s, d <2% to evaluate the conduction losses use the following equation : p=0.42xi f(av) + 0.020 i f 2 (rms)
STPS745D/f/g/fp 3/8 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 t(s) im(a) tc=100c tc=50c tc=150c i m t d =0.5 fig. 3-1: non repetitive surge peak forward current versus overload duration (maximum values) (to-220ac and d 2 pak). 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) t d =tp/t tp single pulse d = 0.1 d = 0.2 d = 0.5 fig. 4-1: relative variation of thermal transient impedance junction to case versus pulse duration (to-220ac and d 2 pak). 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 im(a) tc=100c tc=50c tc=150c t(s) i m t d =0.5 fig. 3-2: non repetitive surge peak forward current versus overload duration (maximum values) (isowatt220ac/to-220fpac). 1e-3 1e-2 1e-1 1e+0 1e+1 0.0 0.2 0.4 0.6 0.8 1.0 t d =tp/t tp tp(s) zth(j-c)/rth(j-c) single pulse d = 0.1 d = 0.2 d = 0.5 fig. 4-2: relative variation of thermal transient impedance junction to case versus pulse duration (isowatt220ac/to-220fpac). 0 25 50 75 100 125 150 175 0 1 2 3 4 5 6 7 8 9 tamb(c) if(av)(a) rth(j-a)=15c/w rth(j-a)=rth(j-c) to-220ac isowatt220ab rth(j-a)=40c/w t d =tp/t tp fig. 2: average current versus ambient temperature ( d = 0.5). 012345678910 0 1 2 3 4 5 6 if(av) (a) pf(av)(w) t d =tp/t tp d = 1 d = 0.5 d = 0.2 d = 0.1 d = 0.05 fig. 1: average forward power dissipation versus average forward current.
STPS745D/f/g/fp 4/8 0 5 10 15 20 25 30 35 40 45 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 5e+4 vr(v) ir(a) tj=150c tj=100c tj=125c tj=75c tj=50c tj=25c fig. 5: reverse leakage current versus reverse voltage applied (typical values). 12 51020 50 100 200 500 1000 vr(v) c(pf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values). 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1.0 10.0 100.0 vfm(v) ifm(a) tj=25c tj=125c tj=125c typical values fig. 7: forward voltage drop versus forward current (maximum values). 0 2 4 6 8 101214161820 0 10 20 30 40 50 60 70 80 s(cu) (cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board, copper thickness: 35 m m).
STPS745D/f/g/fp 5/8 package mechanical data d 2 pak (plastic) a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no less than 2mm 8.90 3.70 1.30 5.08 16.90 10.30 footprint dimensions (in millimeters) ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8
STPS745D/f/g/fp 6/8 package mechanical data to-220ac a c d e m l7 h2 ? i l5 l6 l9 l4 g f1 f l2 ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151
STPS745D/f/g/fp 7/8 package mechanical data to-220fpac h l3 l2 l4 l6 g g1 f f1 d e l7 a b dia l5 ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126
STPS745D/f/g/fp 8/8 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com package mechanical data isowatt220ac f g f1 h d e a b l7 diam l2 l6 l3 ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 b 2.50 2.70 0.098 0.106 d 2.40 2.75 0.094 0.108 e 0.40 0.70 0.016 0.028 f 0.75 1.00 0.030 0.039 f1 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 h 10.00 10.40 0.394 0.409 l2 16.00 0.630 l3 28.60 30.60 1.125 1.205 l6 15.90 16.40 0.626 0.646 l7 9.00 9.30 0.354 0.366 diam 3.00 3.20 0.118 0.126 type marking package weight base qty delivery mode STPS745D STPS745D to-220ac 1.86 g. 50 tube stps745f stps745f isowatt220ac 2 g. 50 tube stps745g stps745g d 2 pak 1.48 g. 50 tube stps745g-tr stps745g d 2 pak 1.48 g. 1000 tape & reel stps745fp stps745fp to-220fpac 1.9 g. 50 tube n cooling method: by conduction (c) n recommended torque value: 0.55 n.m n maximum torque value: 0.7 n.m. n epoxy meets ul94,v0
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